豐羅E-Solder 3022雙組分常溫固化銀膠

Typical applications of E-Solder 3022 are lead terminations, printed circuits and shielding on bases which will not withstand the elevated temperatures required for fired-on coatings or solders. E-Solder 3022 is an epoxy silver paste recommended for applications requiring low electrical resistance and good adhesive properties. E-Solder 3022 requires the addition of Hardener No. 18 to harden and cure. E-Solder 3022 may be cured at room temperature, however the application of heat will accelerate and shorten the cure time

常溫固化銀膠

E-Solder 3022 的典型應(yīng)用是引線端接、印刷電路和底座上的屏蔽，它們不能承受燒制涂層或焊料所需的高溫。E-Solder 3022 是一種環(huán)氧銀漿，推薦用于需要低電阻和良好粘合性能的應(yīng)用。E-Solder 3022 需要添加 18 號(hào)硬化劑來(lái)硬化和固化。E-Solder 3022 可在室溫下固化，但加熱會(huì)加速并縮短固化時(shí)間.

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